There are many ways to mount components onto a board. The two most popular processes are surface mount technology and through-hole technology. Both of those processes use solder to mechanically affix components to the board. One mounting technology type that has become increasingly popular is Press-Fit. This consists of “pins” that are capable of exerting lateral force on the holes in which they are inserted. Press-Fit has been successfully used in many electronics, such as IGBT modules for some time. KEMET is among the first to apply a Press-Fit connection to capacitors
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