Reducing Solder Cracks in MLCCs Due to Thermal Expansion

This whitepaper explores the significance of multilayer ceramic chip capacitors (MLCCs) in the electronics industry, highlighting their widespread usage as surface-mount capacitor devices. MLCCs have garnered increased adoption by displacing other capacitor dielectrics, owing to their advancing capacitance/voltage (CV) capabilities. Notably, these components find applications in critical sectors such as automotive (particularly under the hood), drilling and mining, and aerospace. These environments subject MLCCs to dynamic thermal conditions, necessitating robust resistance to heating and cooling cycles. In markets characterized by rapidly changing thermal environments, such as those mentioned, the ability to withstand temperature fluctuations becomes a crucial requirement. This is particularly pertinent as the variance in thermal expansion between the printed circuit board (PCB) and the MLCC body, along with its termination, poses a potential risk of solder failure, especially when exposed to numerous cycles. In light of these challenges, this whitepaper delves into the factors influencing MLCC performance in demanding applications and explores innovative solutions to enhance their reliability in the face of evolving thermal conditions.

Please note: By downloading a white paper, the details of your profile might be shared with the creator of the content and you may be contacted by them directly.