TO-247-3 Advanced Isolation- Infineon's new fully isolated discrete package

The TO-247-3 Advanced Isolation is a new, fully isolated package introduced by Infineon based on the standard transistor outline TO-247 3-pin. This package has been developed to enable high power density by providing a reliable thermal path from the chip to the application’s heatsink without the need for additional thermal grease. This whitepaper is intended for designers planning to use the TO-247-3 Advanced Isolation package, especially in consumer and industrial applications.

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