GaN Device Channel Temperature, Thermal Resistance, and Reliability Estimates

This whitepaper explains how Qorvo calculates junction-to-case thermal resistance, for product datasheets and also provides a method for estimating device life given the expected device maximum operating temperature. Qorvo’s product datasheets maximize the utility of IR temperature data, Qorvo’s device reliability estimates are based on thermal simulations, verified by micro-Raman measurements.

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