PCB Design Guidelines for QFN Packages

The intent of this whitepaper is to provide PCB designers with a set of guidelines for successful board mounting of Tagore’s Quad Flat No-leads (QFN) packages. The QFN package is a near-chip scale plastic encapsulated (molded) or air cavity package with a copper lead frame substrate, the electrical contact to PCB is made by soldering the lands on the bottom surface of the package to PCB, instead of the conventionally formed perimeter leads.


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