Modeling the Thermal Behavior of GaNPX packages Using RC Thermal SPICE Models

GaN Systems provides RC thermal models allowing customers to perform detailed thermal simulation using SPICE, Models are created based on FEA thermal simulation and have been verified by GaN Systems, The Cauermodel has been chosen allowing customers to extend the thermal model to their system by including interface material and heat sinks, The RC thermal models of GaN Systems’ devices are available in the datasheets.
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