Axcelis Technologies, a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced a shipment of the Company's Purion EXE SiC high energy implanter as well as a successful Purion H200 SiC medium energy implanter evaluation closure at leading power device chipmakers located in Japan. The systems will be used for 150 mm and 200 mm production of silicon carbide power devices supporting automotive, industrial, energy, and other power-intensive applications.

Greg Redinbo, Executive Vice President, Marketing and Applications remarked, "The successful evaluation closure of the 200 mm Purion H200 SiC system enables it to join an existing 200 mm Purion EXE SiC in production at a leading power device customer in Japan." Dr. Redinbo continued, "The shipment of an additional Purion EXE SiC to a new 150 mm customer in Japan highlights growing customer requirements for even higher energy ion implant recipes on advanced SiC power devices, which the Purion Power Series provides."

President and CEO, Russell Low commented, "We look forward to supporting our growing installed base in Japan and remain focused on expanding our market share by providing customers with the most innovative implant technology and support solutions to ensure their success. The Purion Power Series is the market leader due to its highly differentiated features and process control capabilities that enable power device applications. Axcelis is the only ion implant company that can deliver complete recipe coverage for all power device applications."