Semikron Danfoss to Unveil Cutting Edge Power Electronics Technologies at PCIM Europe 2024

Semikron Danfoss to Unveil Cutting Edge Power Electronics Technologies at PCIM Europe 2024

Semikron Danfoss will be showcasing their cutting-edge power electronics solutions at PCIM Europe 2024, taking place from June 11-13 at the Exhibition Centre in Nuremberg, Germany. Attendees can visit them at Hall 7, Booth 7-459. The event promises a comprehensive display of their industry-leading products and innovations, designed to drive the green transition in various sectors such as industry, e-mobility, and renewables.

Visitors will have the opportunity to meet with Semikron Danfoss experts and explore their robust product portfolio, including the SEMITRANS 20 and SKiiP 4 SiC modules, which are equipped with 2 kV SiC chips from multiple sources. These products enable flexible converter development and reduce time-to-profit for applications requiring high power density.

Key products

  • SEMITRANS 20: A next-generation power module for extreme power density applications, offering up to 2 MW of power with 2 kV SiC technology.
  • SKiiP 4 SiC: An intelligent power module (IPM) with integrated driver, current sensing, and protection functions, designed for 1500 V applications.

Stage Presentations and Sessions Semikron Danfoss will also be participating in several presentations and sessions during the event:

  • First SiC IPM for 1500 VDC-Link Voltage: Presented by Anastasia Schiller on June 11, discussing the benefits of the new SKiiP 4 SiC IPM.
  • Increase Power Density & Design Simplicity for 1500 V Applications with 2 kV SiC: Presented by Emiliano Meza on June 12, highlighting the advancements in 2 kV SiC technology for high-power density applications.
  • More Compact and Efficient Motor Drives with Silicon Carbide Power Modules: Presented by Carsten Schreiter on June 12, exploring the latest advancements in SiC MOSFETs for motor drives.
  • Strong Partnerships in Power Electronics - Why They Matter: Presented by Carsten Schreiter on June 13, emphasizing the importance of sustainable supply strategies and strong partnerships in the semiconductor industry.

Conference Contributions

  • An Innovative 3-level Solution for Automotive Application: Pranav Panchal will present on June 12.
  • Investigation of Inorganic Encapsulation Materials in Power Electronic Systems for High Power Density Applications: Stefan Behrendt will present on June 12.
  • Poster Session: Influence of Transfer Molding on the Reliability of DCM SiC Power Modules: Jacek Rudzki will present on June 12.
  • The Design of a 2kV 1700A SiC MOSFET Dual Module: Jorge Mari will present on June 13.

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