Vietnam Semiconductor Packaging and Testing Innovation Summit 2025

Vietnam Semiconductor Packaging and Testing Innovation Summit 2025
  • Date September 18-19, 2025
  • Location
    Ho Chi Minh City, Vietnam
  • Event Type Summit

BCG predicts that Vietnam will become a major global hub for semiconductor packaging and testing by 2030, capturing 5%-10% of the market share. The country's stable political environment, low labor costs, and strategic location attract international investment. The government is driving the industry for economic growth through policy support and infrastructure development. The summit will discuss Vietnam's semiconductor packaging and testing development status, industry trends, and challenges in design, processes, equipment, materials, and supply chain.