PolyCharge has introduced its ThermoLink® capacitor technology for high-power electronic systems used in applications such as electric vehicles, renewable energy systems, aerospace equipment, and industrial power converters. The technology is based on the company’s proprietary NanoLam™ dielectric platform and is designed to provide higher energy density, improved thermal performance, and lower parasitic losses compared with conventional film capacitor technologies. ThermoLink® capacitors are intended for modern power conversion systems that increasingly rely on high switching frequencies, compact packaging, and high-temperature operation.
Built on the company’s proprietary NanoLam™ dielectric technology, ThermoLink® capacitors are designed to deliver significantly higher energy density, elevated temperature capability, and improved current handling compared with conventional polypropylene film capacitors and many multilayer ceramic capacitor (MLCC) solutions. The technology is specifically targeted at modern high-frequency, high-power-density power conversion systems where component miniaturization, thermal stability, and efficiency have become critical engineering challenges.
PolyCharge’s innovation lies in its NanoLam™ architecture, which replaces traditional thermoplastic dielectric film structures with ultra-thin thermoset dielectric layers. Unlike conventional wound film capacitors that rely on separately manufactured extruded films, metallization, and winding processes, PolyCharge’s NanoLam™ manufacturing approach integrates dielectric formation, electrode deposition, and capacitor construction into a unified production process. This architecture enables the creation of extremely thin and highly uniform dielectric layers with fewer defects, resulting in substantially higher breakdown strength and improved volumetric efficiency.
The ThermoLink® platform incorporates multiple individually tested NanoLam™ capacitor elements arranged in stacked, low-profile prismatic structures. This stacked architecture not only improves packaging efficiency but also reduces parasitic inductance and equivalent series resistance (ESR), both of which are increasingly important in modern silicon carbide (SiC)- and gallium nitride (GaN)-based power conversion systems operating at elevated switching frequencies.
One of the major technical differentiators of ThermoLink® capacitors is their self-healing dielectric capability. In conventional high-voltage capacitor systems, dielectric breakdown events can lead to catastrophic failure or progressive degradation. PolyCharge states that its NanoLam™ dielectric structure enables localized self-healing behavior, allowing the capacitor to isolate microscopic defects while maintaining long-term operational stability. This feature is particularly valuable in automotive traction inverters, DC-link applications, aerospace power systems, and industrial motor drives where reliability and operational lifetime are critical design requirements.
Thermal performance is another key focus area for the company. ThermoLink® capacitors are rated for operation above 125°C, with PolyCharge indicating that its thermoset dielectric systems can tolerate substantially higher temperatures than conventional polypropylene capacitor technologies. This capability enables placement closer to heat-generating power semiconductors and supports higher ambient operating environments common in electric vehicle propulsion systems, aviation electronics, and compact industrial converters.
The company also emphasizes the technology’s potential role in reducing overall inverter size and weight. In electrified propulsion systems, DC-link capacitors occupy significant package volume and contribute substantially to system mass. PolyCharge claims its NanoLam™ technology can achieve up to twice the energy density of conventional polypropylene film capacitors while simultaneously improving current density and thermal conductivity. These characteristics could help designers reduce passive component volume while improving switching efficiency and thermal management in high-power converters.
ThermoLink® serves as a platform technology for a broad range of high-voltage applications, including electric vehicles, renewable energy inverters, aerospace systems, medical equipment, defense electronics, and industrial power infrastructure. The technology is also suitable for next-generation wide-bandgap semiconductor architectures, where higher switching frequencies and increased power density place additional stress on conventional passive components.
Beyond component development, PolyCharge has been actively expanding its strategic partnerships and manufacturing ecosystem. The company has collaborated with organizations including BorgWarner, Nagoya University, Globe Capacitors, and aerospace-focused capacitor manufacturers to accelerate the commercialization of NanoLam™-based technologies across automotive, industrial, and defense sectors. Recent research collaborations have additionally focused on integrating NanoLam™ capacitors directly into advanced power module structures to improve switching efficiency and reduce electromagnetic interference in high-frequency power electronics systems.
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About PolyCharge
PolyCharge is a technology company specializing in advanced capacitor solutions based on its patented NanoLam™ platform. The company focuses on developing high-energy density, high-temperature, and high-reliability capacitor technologies designed to meet the evolving demands of electrification across automotive, renewable energy, aerospace, medical, and industrial markets.
