Axcelis Technologies, a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced follow-on shipments of the Company's Purion XE high energy and Purion M medium current Power Series implanters to a leading power device chipmaker located in Japan. The systems will be used in the high volume production of 300 mm thin silicon wafer-based MOSFET and IGBT devices for automotive and other power management applications.

Executive Vice President of Product Development, Bill Bintz, commented, "The unique capabilities of the Purion Power Series, combined with the implant-intensive nature of the power device segment, uniquely positions Axcelis to benefit from growth in this market. These tools incorporate features and process control capabilities, including the platform's thin wafer handling capability, which is enabling the power device market. We look forward to expanding the Purion platform footprint in Japan and supporting our customers' goals to increase their manufacturing capacity."

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