TDK Corporation Unveils Modular Power Capacitors for Renewable Energy Applications

TDK Corporation Unveils Modular Power Capacitors for Renewable Energy Applications

TDK Corporation has unveiled the ModCap series of modular and versatile power capacitors, which offers high energy and power density in an intelligent, ultra-compact modular design. This series is designed to meet the needs of demanding applications such as railway traction, renewable energies, and industrial drives. TDK has made two product lines available: ModCap MF for silicon IGBT modules and ModCap HF for silicon carbide MOSFET (SiC) modules. 

With ModCap HF, TDK adds a series particularly suitable for DC link applications in SiC-based converters. In combination with very fast switching power modules, the components enable compact converters where a compact, robust design and highest power density are required.

This high frequency capability is made possible by the flat capacitor windings connected in parallel as well as the eight terminal contacts and a new type of internal busbar. Therefore, the components can be placed very close to the SiC power modules and thus absorb the high-frequency harmonics excellently up to the frequency range of several hundred kilohertz. The extremely low stray inductance of 8 nH prevents the voltage at the power modules from overshooting too much when the current is switched off. As a result, snubber capacitors are generally not required. This, in turn, reduces the footprint and cost of new-generation inverter designs, especially those using SiC technology.

For both product families, biaxially oriented polypropylene (BOPP) is used as the dielectric, allowing a constant hotspot temperature of +90 °C until a new generation of dielectrics which TDK is currently developing enables hotspot temperatures of up to +125 °C. Simulation software is available to calculate the thermal behavior of the capacitors based on parameters such as frequency spectrum, maximum current, and customer-specific installation conditions.

Key features

  • Modular concept for parallelization especially with IGBTs (ModCap MF) or SiC MOSFETs (ModCap HF) 
  • Extremely low ESL of 14 nH (ModCap MF) or even 8 nH (ModCap HF) 
  • Temperature up to +90 °C hot spot 
  • Lifetime up to 200.000 hours 
  • Simulation software available

Key benefits

  • Cost optimization
  • Reduced time to market and lead time
  • Compact and high power density converters e.g., light traction or renewable energy  
  • Low voltage overshoot, therefore, no snubber capacitors are needed  

Construction and Standards:

  • Filled with polyurethane resin (dry technology)
  • Plastic case (open)
  • Flat windings
  • Use of biocircular films
  • 8 terminals connection with a new generation of internal bus bar (ModCap HF)
  • EC 61071, IEC 61881-1, EN 45545-2 HL3 R23 (fire and smoke), UL recognized  

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