Alpha and Omega Semiconductor announced it will exhibit and demonstrate its advancements in delivering application-specific power semiconductor, power IC, and module solutions at PCIM 2025. Attendees will learn about the company’s groundbreaking power management product innovations that solve critical design challenges in multiple strategic markets and match key application specifications. The AOS products highlighted at PCIM will include:

Booth highlights

• Automotive and Industrial: AOS is introducing its AEC-Q101 qualified Generation 3 1200 V SiC MOSFET technology that will provide a 20-30 percent loss improvement compared to the already leading Gen 2 technology.  This performance enhancement will not come with a penalty to robustness as the Gen 3 technology has improved ruggedness, including full HV-H3TRB compliance for harsh environment applications. These new MOSFETs expand the existing automotive-qualified 650 V, 750 V, 1200 V, and 1700 V SiC MOSFETs in through-hole and surface mount/topside cooled packages. The 1200 V Gen 3 SiC MOSFETs will initially be available from 15 to 40 milliohm in TO247-4L packages with production starting May 2025.
• Intelligent Power Modules, Mega IPM-7: AOS has integrated its latest G2 IGBT and high-voltage gate driver into the world's most compact package design, delivering mega power of up to 100 W for motor control applications. The portfolio covers 600 V / (1 A-3 A) in various package options (Mega IPM-7D, IPM-7DT, IPM-7E) that are ideal solutions for various design requirements.
• Motor Drive ICs: AOS will announce a new range of 60 V and 100 V driver ICs for power tools, outdoor garden equipment, and e-mobility applications, including a 100 V half-bridge driver IC, a 100 V 3-phase driver IC, and a 60 V 3-phase driver IC. These products all support 100 percent duty cycle operation. Plus, demo boards using AOS’ motor driver IC and AlphaSGT MOSFETs (30 V-150 V) will be featured.
• eFuse: AOS’ Hot Swap Controllers and Power MOSFET combined into a single eFuse package. The eFuse can improve the system’s reliability by isolating the load from the main power rails in case of a fault condition. AOS will announce its latest 12 V/60 A eFuse products in May 2025.
• State-of-the-art Packaging: AOS’ highly efficient 25V-150V MOSFETs are available in advanced packaging, including a double-sided cooling DFN 5x6 that delivers industry-leading thermal resistance. Also available are two robust packages, LFPAK 5x6 package and the GLPAK, which features gull-wing leads for enhanced board reliability and larger copper clips that significantly improve current carrying capability. In addition, the GTPAK is a topside cooling package designed with a large exposed pad for more efficient heat transfer.

Where:  PCIM 2025, Nuremberg, Germany

When:  May 6 - 8, 2025

Location:  Alpha and Omega Semiconductor, Booth # 9-539

Click here to learn more about everything PE's coverage on PCIM 2025.