Nidec Advance Technology Corporation announced that it has launched, a Semiconductor Device Temperature Measurement Probe, and a Chamber Head Type Probe Card for High Voltage applications.

In recent years, demand for power semiconductors used in electric vehicles (EVs) and industrial equipment has increased, leading to a growing need for more accurate, high-quality inspection of power semiconductors that handle high voltages and currents, especially under high temperatures.

TC (Thermo Couple) probe

Semiconductor Device Temperature Measurement Probe introduces a thermocouples technology “TC (Thermo Couple) probe” into the probe card. These TC probes contact existing PAD and provide a quite accurate device surface temperature measurement solution during wafer testing

Chamber Head type Probe Card

Chamber Head type Probe Card is a probe card with a pressurized chamber structure that can increase the withstand voltage while the pitch between contact terminals is narrowing with the demand for miniaturization of devices. 

By filling various gases using our unique technology, this probe card prevents damage to devices caused by discharge. By filling it with nitrogen gas, it is possible to prevent the damage caused by discharge and also to suppress oxidation of the probe and device during testing. This helps to extend the life of the probe and improve contact performance to test the device.

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